迪思科科技（中国）有限公司及几款半导体加工设备的介绍

DISCO 为全球最大半导体划片，磨片，抛光加工设备供应商。迪思科科技（中国）有限公司为其在华的全资子公司。

本公司现有专业的现场服务工程师、工艺开发工程师超过80 名、并在上海、苏州、北京、天津、成都、深圳、大连、西安、惠州、厦门及武汉设有分公司或办事处, 实现了中国大陆半导体产业发达地区的全面覆盖。

本公司在上海总部配备有 DGP8761、DFD6362 、DFD6340 、DFL6560 、DAD3650 、,DAD3350、DAD322、DFG8540、DFL7020 等供工艺开发和人员培训的设备。

DISCO 总公司连续11年获得Intel 公司的最佳供应商奖，全球仅此一家。本公司作为DISCO全资子公司，也获得了Intel 在华分公司的高度评价与认可。三星、海太、华润、天水华天等多家国内外半导体制造企业也对本公司的产品质量和售后服务都有良好评价，并成为本公司的忠实客户。

以下就几款设备作一些简单介绍：

The DAD3650 is a manual dicer with facing dual spindles having high throughput and compact footprint.

Advantages:

High Throughput Compact Footprint Process ability Operability□Reduced process time by using a dual cut□High speed X,Y and Z-axes□Distance between blades:24 mm□World's smallest dual dice□8"/250 mm sq.work piece capable□Handles various dual spindle applications□Color touch panel+GUI□Automatic alignment installed as standard

The DFD6560 is a fully automatic dicer for准300 mm wafers, featuring a space-saving layout ideal when installing multiple units in the same area.

Advantages:

Space saving Improved throughput Optional measures to eliminate particles User friendliness□16%smaller footprint than the DFD6362□Concentrated front access□Eliminates the need for side maintenance areas□Built-in optional units□Thin-type 20 mm wheel cover□Atomizing nozzle cleaning□Function to prevent drying and adhesion□Graphical display enabling Intuitive operation□Kerf check error recovery□MTBA status display

The DFL7161 is a fully automatic laser saw with support for 准300mm wafers, which improves the productivity and reliability.

Advantages:

Improved throughput Shortened MTTR Ease of use Major applications□Independent coater and spinner□Improved high acceleration speed of the X-axis□Dedicated optical system for grooving,BSS6 installed□Improved laser monitoring function□Operation screen mode added□Low-k grooving□Si full cut

The DAS8930 is a semi-auto surface planer which is simple and compact. Optional for R&D,small production, multiple work piece processing.

Advantages:

Targets Unit configuration Operability□Ultra precision cutting process which diamond bit is used□Biggest wafer size 准300 mm□Thickness variation within a wafer≦3.0 μm□Surface roughness of bump(Rz)≦□Compact semi-auto device□1 axis 1 chuck table□Wafer thickness measuring part loaded□2.0 kW spindle□DISCO's operation common to grinders which is convenient to use□Safety(obtained CE,conforms to Semi S2-0703 or S8-1103)