《电子与封装》2016年第16卷1~12期目次索引

2016-03-09 21:48:50
电子与封装 2016年12期
关键词:芯片工艺设计

《电子与封装》2016年第16卷1~12期目次索引

作者 期(页)

封装、组装与测试

拉钩位置对引线拉力试验键合强度测试值影响分析 凌 勇,吕 音 一(1)

引线框架塑料封装集成电路分层及改善 周朝峰,周金成,李习周 一(5)

DFT类IC的多SITE高效测试研究 孙恺凡 一(9)

基于ATE的可编程逻辑器件测试方法 解维坤 一(12)

基于X射线成像的PBGA器件焊接质量检测 何志刚,梁 堃,周庆波,龚国虎,王晓敏 二(1)

叠层芯片引线键合技术在陶瓷封装中的应用 廖小平,高 亮 二(5)

TO型陶瓷外壳封接失效模式有限元分析 司建文,郭怀新,王子良 二(9)

基于SSIP4L封装的磁传感器工艺研究 陈国岚,牛社强,何文海 二(14)

SiC混合功率模块封装工艺 徐文辉,陈云,王立 三(1)

多次回流对不同成分Sn-Pb凸点IMC生长的影响 文惠东,林鹏荣,练滨浩,王 勇,姚全斌 三(4)

可伐与铝碳化硅复合材料气密低温钎焊工艺研究 金家富,杨 程,霍绍新 三(9)

MCM封装技术新进展 胡燕妮 三(12)

NOR型FLASH存储器测试技术 王征宇,赵桦 三(15)

一种新型芯片粘接用导电银胶的性能研究 邹嘉佳,高 宏,周金文 四(1)

系统级封装中焊点失效分析技术 潘书山,陈颖,季斌 四(4)

基于测试系统控制示波器实现模拟信号测试方法 杜元勋 四(9)

宇航元器件在轨测试研究 陈嘉鹏,蔡洁明,黄旭东,宋国栋 四(13)

基于V93000ATE的MTL生成功能码的方法 赵 桦,王征宇,李 锴 四(18)

先进射频封装技术发展面临的挑战 夏雨楠,陈宇宁,许丽清,戴 洲,李华新,程 凯 五(1)

RBFN优化算法在键合机标定中的应用 洪 喜,李 维,卢 佳,白 虹,孙海波 五(7)

LTCC多层基板腔体工艺研究 李姗泽,刘红雨,杜 彬,冯晓曦,马其琪 五(10)

一种混合工艺型微波密封腔体的研制 王 辰,陈 侃,郑冬侠 五(14)

基于文献统计方法的多芯片模块技术评价研究 吕旭波,黄姣英,高 成,王香芬 五(18)

粘片胶固化对塑封集成电路可靠性的影响 李强,李红 五(25)

Sn-Cu-Ni系无铅钎料的研究现状 陈哲,李阳 六(1)

TO型封装的真空储能焊密封工艺研究 黎小刚,许健 六(10)

SiP封装传感器中金丝可靠性设计与分析 刘建军,郭育华 六(14)

纳米级无机粒子对环氧树脂胶黏剂击穿电压的影响 莫洪强,秦会斌,毛祥根 六(17)

功率MOSFET器件栅电荷测试与分析 张文涛,皓月兰 六(21)

基于UltraFlex的多时钟域电路测试方法 严华鑫 六(24)

多芯片陶瓷封装的结—壳热阻分析方法 高 辉,仝良玉,蒋长顺 七(1)

LTCC生瓷层压中腔体的形变评价及控制 王运龙,刘建军,柳龙华,邱颖霞,王志勤 七(5)

纳米无机粒子对环氧树脂胶黏剂导热性能的影响 莫洪强,秦会斌,毛祥根 七(10)

光电器件用金属外壳高频性能的改进 袁中朝,许 健,崔大健,姚科明 七(14)

电子封装用硅铝合金激光气密焊接研究 徐 骁,刘 艳,陈洁民,程 凯 八(1)

破坏性试验能力验证方法研究 杨城,谭晨,王伯淳 八(5)

接触孔关键尺寸测量研究与工序能力提高 李幸和 八(9)

基于场协同理论的电子元件散热CFD数值模拟 马芳芳,云和明,李永真 九(1)

基于SiP技术的空间飞行器综合电子系统 黄 虎,李 华,孔 勇,范国臣,张耀磊 九(6)

一种锂电池充电电路的测试方法张鹏辉 九(10)

互联印制板技术发展概况 邹嘉佳,赵丹,程明生 十(1)

CCGA用焊柱发展现状及面临的挑战 李守委,毛冲冲,严丹丹 十(6)

LTCC不锈钢网版清洗工艺优化 卢会湘,陈 磊,唐小平,严英占 十(11)

集成电路测试移机评价方法 何燕青 十(15)

准气密空腔型外壳的封装技术 高 辉,肖汉武,李宗亚 十一(1)

低噪声放大器的自动测试开发 张凯虹,苏 扬,武乾文 十一(7)

集成电路中MOS管导通电阻测量方法 韩新峰,顾卫民 十一(10)

基于ATE的电源芯片Multi-Site测试设计与实现 唐彩彬 十一(14)

微组装金丝键合工序统计过程控制技术 范少群,赵丹 十二(1)

粘接促进剂对环氧模塑料粘结力和分层的影响 秦旺洋,张高文,丁全青 十二(6)

光窗的铟锡合金真空焊接工艺研究 王彬彬,江德凤 十二(12)

一种光信号处理芯片测试技术研究 张鹏辉 十二(16)

视觉系统在检测对称器件倒反入载带中的应用 唐明津,张 君 十二(20)

一种利用迭代法实现的熔丝修调方案 吴熙文,顾卫民 十二(23)

电路设计

McBSP与SPI通信的时序与波特率配置分析 孙 敬,陶建中,陈振娇 一(16)

同步整流BOOST型DC/DC软启动电路 李 良,来鹏飞,曹发兵,陈 峰 一(21)

系统级芯片跨时钟域同步技术研究 汪 健,张 磊,王 镇,赵忠惠,陈亚宁 一(25)

一种基于TYPE-Ⅱ跟踪型RDC算法的电路设计 刘太广,包生辉,苗 韵,强小燕 一(31)

数字信号处理微系统设计 杨芳,王良江 二(19)

一种用于以太网收发器的基带漂移消除器的设计张 帅,许圣全,于建旺,李正昊,邱益波,郑 燕 二(23)

Buck型DC-DC电路振铃现象的抑制 来鹏飞,陈 峰,曹发兵,李 良 二(28)

Ku波段收发组件设计分析 姚若妍,魏斌 二(33)

FPGA配置SRAM设计技术 张艳飞,耿杨 三(20)

基于CMOS工艺的ARINC 429总线接收器设计 李珂,顾飞 三(23)

基于DICE结构的SRAM抗辐照加固设计 沈婧,薛海卫 三(26)

一种多通道缓冲串口的设计与实现 杨晓刚,强小燕,刘太广 三(31)

应用于开关电源芯片的频率抖动技术 孙大成 三(37)

一种基于Scanchain的Block RAM的MBIST设计方法 丛红艳,闫华,胡凯,张艳飞 四(21)

一种无运放高电源抑制比的带隙基准设计 刘俐 四(24)

一种无线充电管理系统的电路设计 杨培凯,石雄 四(29)

一种基于比幅比相的单脉冲雷达接收机 支敏,张晖 四(34)

一款高增益、低功耗、宽带宽全差分运放设计 周 吉,龚 敏,高 博 五(26)

FPGA芯片时钟架构分析 张艳飞,谢长生,匡晨光 六(28)

一种嵌入式NOR Flash控制器IP的设计 解同同,李天阳 七(18)

高速SRAM编译器时序算法 黄奔,彭力,吴海宏 七(22)

一种高速LVDS接收电路的设计 胡庆城,贺凌炜,周晓彬 七(26)

一种用于OTP存储器的灵敏放大器设计 袁同伟,潘 滨,孙杰杰,胡晓琴 七(29)

FIR算法在可重构专用处理器中的并行化实现 顾志威,李 丽,傅传张,傅玉祥,李 伟 八(14)

改进DICE结构的D触发器抗SEU设计 孙 敬,陈振娇,陶建中,张宇涵 八(19)

一种基于DSP的通用存储器接口的设计 解同同,李天阳 八(24)

一种应用于DDS 14位1 GS/s电流舵型DAC的设计 杨俊浩,张甘英,张 涛 八(30)

一种曲率补偿的高精度带隙基准源设计 吕江萍,胡巧云 八(34)

一种CMOS工艺高速端口的ESD保护设计 孙云华,邹家轩 九(14)

基于反馈控制的高阶温度补偿带隙基准电路 王宇星,吴 金 九(18)

一种基于PCI总线的数字图形发生器设计 芦 俊,张国良,曹 菁,陈 仑 九(24)

毫米波T/R子阵研究与设计 张维,张均华 九(28)

基于SKILL语言的参数化抗辐射器件版图设计 胡永强,周 源 九(31)

一种适用于FPGA系统中的变速箱电路设计 罗 旸,何光旭,雷淑岚 十(19)

带看门狗喂狗功能的TMS320F2812远程加载技术 蒋炯炜,雷志军,于 鹏 十(23)

一种低电压低功耗多谐振荡器 应韬,陈迪平,李经珊 十(27)

千万门级FPGA装箱及验证 胡 凯,董志丹,惠 锋,李 卿,董宜平 十(32)

一种带有失调消除电路的带隙基准设计 许圣全,张帅 十一(18)

FPGA中开关矩阵的研 胡 凯,谢 达,刘 彤,张艳飞,单悦尔 十一(23)

一种用于高度表测量系统的射频前端收发组件 蔡 茂,潘 碑,郁 健,马建军,温艳兵 十一(27)

一种用于微波控制电路控制端口的静电/浪涌电压泄放结构潘结斌,陈计学,姜 楠 十一(31)

移相全桥零电压PWM软开关电路谐振过程研究 王金刚,刘 鹏 十一(35)

宽带定向耦合器的设计与应用 王家波,曹雪松 十一(39)

一种内嵌于DSP2F0X的ECAN设计及其通讯系统实现 鲍宜鹏,强小燕 十二(26)

一种高精度温度补偿型实时钟电路 陈富涛 十二(30)

大容量同步双端口SRAM的仿真方法 周云波,李晓容 十二(35)

微电子制造与可靠性

一种变温变掺杂流量的埋层外延生长方法 赵建君,肖建农,马林宝 一(34)

激光调阻L型切割的仿真分析 刘建军,王运龙 二(37)

HTCC一体化管科失效问题分析 邱颖霞,胡 骏,刘建军 三(41)

商用0.18 μm CMOS工艺抗总剂量辐射性能研究 寇春梅,谢儒彬,洪根深,吴建伟 四(40)

溅射设备腔室处理工艺的优化研究 王海东 四(45)

一种NiO薄膜的新型制备方法及其应用 叶珂,乔明 五(31)

8路宽带扩展同轴功分器 章勇佳,钱兴成,祝庆霖 五(35)

LTCC曲面基板制造技术 卢会湘,严英占,唐小平,明雪飞 五(39)

LCP基RF MEMS开关的工艺研究党元兰,赵 飞,韩 磊,徐亚新,梁广华,刘晓兰,陈 雨,庄治学 五(43)

CMOS工艺中等离子体损伤WAT方法研究 陈培仓,徐 政,李 俊 六(31)

一种新型CMOS器件长期贮存寿命评价试验方法 刘士全,徐 超,秦晨飞,王健军 六(36)

元器件二次筛选过程中的质量控制 王小萍 六(39)

L波段大功率开关的研制 孟向俊,杨磊,黄贞松,宋 艳,许 庆 七(34)

0.18 μm完全隔离型低导通态电阻(Low Ron)NLDMOS研究 冯喆韻,马千成,汪 铭 七(39)

NAND Flash浮栅干法蚀刻工艺优化解决数据写入失效 陈 亮,周朝锋,李晓波 七(44)

薄外延CMOS芯片阱掺杂浓度与击穿电压的关系 韩兆芳,谢 达,乔艳敏 八(37)

基于Ge2Sb2Te5存储介质的相变存储器疲劳特性分析 李 莹,詹奕鹏,王 蕾 八(41)

用248 nm光刻机制作150 nm GaAs PHEMT器件性能及可靠性评估 郭 啸,章军云,林 罡 八(44)

一种改善器件性能的Halo工艺 徐 政,李红征,赵文彬 九(35)

体硅CMOS集成电路抗辐射加固设计技术 米 丹,左玲玲 九(40)

硅的深度反应离子刻蚀切割可行性研究 刘学勤,董安平 九(44)

先进节点接触层照明类型优化解决光刻制造要求 刘娟 十(36)

T/R组件功放芯片瞬态温度响应研究 盛 重,周 骏,丁晓明,沈 亚 十(39)

微波晶体管满功率老炼技术研究 王小萍,李 雪,张利敏,秦 皓 十(43)

1200 V IGBT的性能优化 李宏 十一(44)

二次筛选生产过程中的质量控制 王瑜 十二(40)

产品、应用与市场

集成电路分选机的维修及应用周 淳,蒋文广 一(38)

基于TMS320DM8168嵌入式图像处理系统的软件设计 王小龙,邵春伟,朱 琛 一(44)

一种高可靠串行通信协议 桂江华,邵健,潘邈 二(40)

基于微型计算机的高压交流参数自动测试系统 陈 洋,谢立利 二(44)

一种新型热导式氧气浓度测量方法 钱江蓉,陈 丛,许 磊,胡国俊 三(45)

一种WLCSP元器件先进运输包装材料解决方案 杨 青 六(43)

基于物联网技术的地表水质监测预警系统设计 张 静,皇甫玮喆 十二(44)

Electronics&Packaging

Vol.16,No.1~12 Contents Index(2016)

Author No.Page

Packaging&Assembly&Testing

Analysis of Hook Position in Double Bond Pulling Test LING Yong,LV Yin 1(1)

Delamination and Its Countermeasures in IC Plastic Package ZHOU Chaofeng,ZHOU Jincheng,LI Xizhou 1(5)

Researching of Multi-site Efficient Test for DFT IC SUN Kaifan 1(9)

The Research of Programmable Logic Device Testing Method Based on the ATE XIE Weikun 1(12)

BGA Soldering Quality Detection Techniques by X Ray Imaging HE Zhigang,LIANG Kun,ZHOU Qingbo,GONG Guohu,WANG Xiaomin 2(1)

Application of Wire Bonding of Multi-Stack Die in the Ceramic Package LIAO Xiaoping,GAO Liang 2(5)

Finite Element Analysis of Failure Mode of TO Ceramic Package SI Jianwen,GUO Huaixin,WANG Ziliang 2(9)

Assembly Technology Research of Magnetic Sensor in SSIP4L Package CHEN Guolan,NIU Sheqiang,HE Wenhai 2(14)

Packaging Process of SiC Hybrid Power Module Xu Wenhui,CHEN Yun,WANG Li 3(1)

Study on IMC Formation of Different Sn-Pb Bumps with Multiple Reflow Times WEN Huidong,LIN Pengrong,LIAN Binhao,WANG Yong,YAO Quanbin 3(4)

Hermetic Soldering Technics on Kovar and AI/SiCp Composite Material JIN Jiafu,YANG Cheng,HAO Shaoxin 3(9)

The Research of MCM Packaging Technology HU Yanni 3(12)

The Research of Testing Technology for Flash Memory of NOR Type WANG Zhengyu,ZHAO Hua 3(15)

Performance Study of a Novel Silver-filled Conductive Adhesive Used for Die Bonding ZOU Jiajia,GAO Hong,ZHOU Jinwen 4(1)

Failure Analysis of Solder Joint in SiP Modules PAN Shushan,CHEN Ying,JI Bin 4(4)

Test Method of Analog Signals Based on TR6800 Controls OSC DU Yuanxun 4(9)

The Research of Aerospace Components Measurement Applied in Space Orbit CHEN Jiapeng,CAI Jieming,HUANG Xudong,SONG Guodong 4(13)

Research on Producing Pattern Files Based on the V93000 ATE MTL ZHAO Hua,WANG Zhengyu,LI kai 4(18)

The Challenges Confronting the Development of Advanced RF Packaging Technology XIA Yunan,CHEN Yuning,XU Liqing,DAI Zhou,LI Huaxin,CHENG Kai 5(1)

Error Compensation Based on RBF in Bonder HONG Xi,LI Wei,LU Jia,BAI Hong,SUN Haibo 5(7)

Research on Process of Cavity in LTCC Substrate LI Shanze,LIU Hongyu,DU Bin,FENG Xiaoxi,MA Qiqi 5(10)

The Development of a Hybrid-technique-manufactured Microwave Sealed Cavity WANG Chen,CHEN Kan,ZHENG Dongxia 5(14)

Evaluation Research of Chip Assembly Technology Based on Statistical Methods of Literature LV Xubo,HUANG Jiaoying,GAO Cheng,WANG Xiangfen 5(18)

The Effect of Epoxy on the Reliability of Plastic Integrated Circuit LI Qiang,LI Hong 5(23)

Research Status of Sn-Cu-Ni Solders CHEN Zhe,LI Yang 6(1)

Semiconductor Devices TO Vacuum Packaging Based on Discharge Welding LI Xiaogang,XU Jian 6(10)

Reliability Design and Analysis of Gold Wire in SiP Sensor Module LIU Jianjun,GUO Yuhua 6(14)

Effect of Nano Inorganic Particles on Epoxy Resin Adhesive Breakdown Voltage MO Hongqiang,QIN Huibin,MAO Xianggen 6(17)

Test and Analysis of Gate Charge in MOSFET ZHANG Wentao,HAO Yuelan 6(21)

Test Method for UltraFlex-based Multiple Clock Domain Circuit YAN Huaxin 6(24)

Studies on Analysis Method of Junction-to-Case Thermal Resistance of Ceramic Multi-chip Packaging GAO Hui,TONG Liangyu,JIANG Changshun 7(1)

Evaluation and Control Method of Cavity Deformation in LTCC Green Tape Lamination Process WANG Yunlong,LIU Jianjun,LIU Longhua,QIU Yingxia,WANG Zhiqin 7(5)

Imapact of Nanoparticles on Thermal Properties of Epoxy Adhesive MO Hongqiang,QIN Huibin,MAO Xianggen 7(10)

Microwave Performance Improvement of Metal Packages for Optoelectronic Devices YUAN Zhongchao,XU Jian,CUI Dajian,YAO Keming 7(14)

Research of Packaging-used Silumin Alloys in Hermetic Laser Welding XU Xiao,LIU Yan,CHEN Jiemin,CHENG Kai 8(1)

Research of the Proficiency Testing for Destructive Test YANG Cheng,TAN Chen,WANG Bochun 8(5)

Research on Contact Critical Dimension Measurement and Process Capability ImprovementLI Xinghe 8(9)

CFD Numerical Simulation of Electronic Equipment Cooling in the Perspective of Field Synergy Principle MA Fangfang,YUN Heming,LI Yongzhen 9(1)

SiP-based Integrated Electronic System of Spacecraft HUANG Hu,LI Hua,KONG Yong,FAN Guochen,ZHANG Yaolei 9(6)

A Test Method of Lithium Battery Charging IC ZHANG Penghui 9(10)

Overview of Development of Interconnected PCB ZOU Jiajia,ZHAO Dan,CHENG Mingsheng 10(1)

Status-Quo and Challenges of CCGA Solder Columns LI Shouwei,MAO Chongchong,YAN Dandan 10(6)

Optimization of Stainless Screen Cleaning During LTCC Process LU Huixiang,CHEN Lei,TANG Xiaoping,YAN Yingzhan 10(11)

Evaluation of IC Test Equipment after Replacement HE Yanqing 10(15)

Studies of Quasi-hermetic Air Cavity Packaging GAO Hui,XIAO Hanwu,LI Zongya 11(1)

An Automatic Test Method for LNA ZHANG Kaihong,SU Yang,WU Qianwen 11(7)

Studies of MOS Turn-on Resistance Measurement Methods HAN Xinfeng,GU Weimin 11(10)

A Design and Implementation Scheme of Multi-Site Test for ATE-based Power Chip TANG Caibin 11(14)

Research of Statistic Process Control in Gold Wire-bonding FAN Shaoqun,ZHAO Dan 12(1)

Studies of Effect of Adhesion Promoter on Epoxy Molding Compound QIN Wangyang,ZHANG Gaowen,DING Quanqing 12(6)

Research of InSn48 Vacuum Soldering for Optoelectronic Window WANG Binbin,JIANG Defeng 12(12)

Research of a Test Technology for Optical Signal Processing Chip ZHANG Penghui 12(16)

Application of Vision Inspection System for Symmetrical Device Misplacement on Packing Tape TANG Mingching,ZHANG Jun 12(20)

An Iteration-based Fuse Trimming Test Method WU Xiwen,GU Weimin 12(23)

IC Design

The Functional Verification and Simulation of McBSP Communication Based on SPI Protocol SUN Jing,TAO Jianzhong,CHEN Zhenjiao 1(16)

Synchronous Rectification DC/DC BOOST Soft Start Circuit LI Liang,LAI Pengfei,CAO Fabing,CHEN Feng 1(21)

Research of Synchronization for Signals Cross Clock Domains in SoC Design WANG Jian,ZHANG Lei,WANG Zhen,ZHAO Zhonghui,CHEN Yaning 1(25)

A Design of Circuit of RDC on the Basic of the TypeⅡTracking Loop Algorithm LIU Taiguang,BAO Shenghui,MIAO Yun,QIANG Xiaoyan 1(31)

Microsystems Analysis and Design YANG Fang,WANG Liangjiang 2(19)

Design of a Baseline Wander Canceller for Ethernet Transceiver ZHANG Shuai,XU Shengquan,YU Jianwang,LI Zhenghao,QIU Yibo,ZHENG Yan 2(23)

The Restrain of Ringing Phenomenon for Buck DC-DC Circuit LAI Pengfei,CHEN Feng,CAO Fabing,Li Liang 2(28)

The Design of Ku-band T/R Module YAO Ruoyan,WEI Bin 2(33)

FPGA Configuration SRAM Design Technology ZHANG Yanfei,GENG Yang 3(20)

Design of an ARINC 429 Line Receiver Based on General CMOS Technology LI Ke,GU Fei 3(23)

Design of Radiation Hardened SRAM Based on DICE SHEN Jing,XUE Haiwei 3(26)

The Design and Implementation of a Multichannel Buffered Serial Port YANG Xiaogang,QIANG Xiaoyan,LIU Taiguang 3(31)

The Research of Frequency Jitter Using in Monolithic Switching Power IC SUN Dacheng 3(37)

A Design of MBIST Based on Scan Chain Block RAM CONG Hongyan,YAN Hua,HU Kai,ZHANG Yanfei 4(21)

Design of a High PSRR Bandgap Reference without Using an Opamp LIU Li 4(24)

A Kind of Circuit Design of Wireless Charging Management System YANG Peikai,SHI Xiong 4(29)

Mono-pulse Radar Receiver Based on Gain and Phase Detect ZHI Min,ZHANG Hui 4(34)

Design of a Fully Differential High Gain and Low-power and High Bandwidth Amplifier ZHOU Ji,GONG Min,GAO Bo 5(26)

Clock Architecture Analysis of FPGA Chip ZHANG Yanfei,XIE Changsheng,KUANG Chenguang 6(28)

Design of an Embedded NOR Flash Controller IP XIE Tongtong,LI Tianyang 7(18)

High-Speed SRAM Compiler Timing Algorithm HUANG Ben,PENG Li,WU Haihong 7(22)

Design of a High-Speed LVDS Receiver HU Qingcheng,HE Lingwei,ZHOU Xiaobin 7(26)

Design of a Sense Amplifier for OTP Memory YUAN Tongwei,PAN Bin,SUN Jiejie,HU Xiaoqin 7(29)

Parallel FIR Filter Based on Reconfigurable Processor GU Zhiwei,LI Li,FU Chuanzhang,FU Yuxiang,LI Wei 8(14)

Design of Radiation Hardened D Flip-Flop Based on DICE SUN Jing,CHEN Zhenjiao,TAO Jianzhong,ZHANG Yuhan 8(19)

Design of a DSP-based Universal Memory Interface XIE Tongtong,LI Tianyang 8(24)

Design of 14-bit 1 GS/s Current Steering D/A Converter for DDS Application YANG Junhao,ZHANG Ganying,ZHANG Tao 8(30)

Design of a Bandgap Reference with Curvature Compensation LV Jiangping,HU Qiaoyun 8(34)

ESD Protection Design for CMOS High Speed I/O SUN Yunhua,ZOU Jiaxuan 9(14)

A High Order Temperature Compensation Bandgap Voltage Reference Based on the Feedback Controlling WANG Yuxing,WU Jin 9(18)

A Design Method of PCI-bus-based Digital Pattern Generator LU Jun,ZHANG Guoliang,CAO Jing,CHEN Lun 9(24)

Investigation and Design of Millimeter-wave T/R Sub-array ZHANG Wei,ZHANG Junhua 9(28)

Layout Design of SKILL-based Parameterized Radiation-hardened Device HU Yongqiang,ZHOU Yuan 9(31)

Design of Gearbox Circuits for FPGA System LUO Yang,HE Guangxu,LEI Shulan 10(19)

A Technology of Remote Flash Programming to TMS320F2812 with Watchdog-feeding Function JIANG Jiongwei,LEI Zhijun,YU Peng 10(23)

A Design of Low-Voltage and Low-Power Consumption Multivibrator YING Tao,CHEN Dingping,LI Jingshan 10(27)

Packing Implementation and Verification for 10M-gate FPGA HU Kai,DONG Zhidan,HUI Feng,LI Qing,DONG Yiping 10(32)

A Design of Bandgap Voltage Reference Circuit with Offset Voltage Elimination Function XU Shengquan,ZHANG Shuai 11(18)

Studies of FPGA Switch Matrix HU Kai,XIE Da,LIU Tong,ZHANG Yanfei,SHAN Yueer 11(23)

A Design of RF Front-end TR Module for Altimeter Measuring System CAI Mao,PAN Bei,YU Jian,MA Jianjun,WEN Yanbing 11(27)

A Design of Electrostatic/Surge Voltage Discharge Structure for Control Port of Microwave Control Circuit PAN Jiebin,CHEN Jixue,JIANG Nan 11(31)

Studies of Resonance Process for Shifted-Phase Full-Bridge Zero-Voltage PWM Soft-Switching Circuit WANG Jingang,LIU Peng 11(35)

Design and Application of Wideband Directional Coupler WANG Jiabo,CAO Xuesong 11(39)

A Design of ECAN Embedded in DSP2F0X and Communication System BAO Yipeng,QIANG Xiaoyan 12(26)

A Design of TCXO Chip with High Accuracy and Wide Compensation Temperature Range CHEN Futao 12(30)

Research on Simulation Method of Large Capacity Synchronous Dual-port SRAM ZHOU Yunbo,LI Xiaorong 12(35)

Device Fabrication&Reliability

A Buried-layer Epitaxy Technology by Varying Temperature and Doping Flow ZHAO Jianjun,XIAO Jiannong,MA Linbao 1(34)

Simulation Analysis of Laser Trimming Using L-Cut LIU Jianjun,WANG Yunlong 2(37)

Failure Analysis of HTCC Integral Substrate/Package QIU Yingxia,HU Jun,LIU Jianjun 3(41)

Study of Commercial 0.18 μm CMOS Total Ionizing Dose Effects KOU Chunmei,XIE Rubin,HONG Genshen,WU Jianwei 4(40)

The Optimization Study on Process Flow of Sputter Equipment Chamber WANG Haidong 4(45)

A New Method to Fabricate NiO Thin Films and Its Application YE Ke,QIAO Ming 5(31)

8-Way Wideband Oversized Coaxial Power Divider ZHANG Yongjia,QIAN Xingcheng,ZHU Qinglin 5(35)

Fabrication Technology for LTCC Curved SubstrateLU Huixiang,YAN Yingzhan,TANG Xiaoping,MING Xuefei 5(39)

Processing Study on LCP RF MEMS Switch DANG Yuanlan,ZHAO Fei,HAN Lei,XU Yaxin,LIANG Guanghua, LIU Xiaolan,CHEN Yu,ZHUANG Zhixue 5(43)

Studies on Testing Plasma Damages in WAT in CMOS Technology CHEN Peicang,XU Zheng,LI Jun 6(31)

A New Evaluation Test for Long Storage Life of CMOS Component LIU Shiquan,XU Chao,QIN Chenfei,WANG Jianjun 6(36)

Electronic Components Quality Control During Secondary Screening Process WANG Xiaoping 6(39)

Design of L-band Power Switch MENG Xiangjun,YANG Lei,HUANG Zhensong,SONG Yan,XU Qing 7(34)

Studies of 0.18μm Fully Isolated Low Ron NLDMOS FENG Zheyun,MA Qiancheng,WANG Ming 7(39)

NAND Flash Floating Gate Dry Etch Technology Optimization to Tackle Program Failure CHEN Liang,ZHOU Chaofeng,LI Xiaobo 7(44)

Research of Relationship Between Well Doping Concentration and Breakdown Voltage in Thin-Epitaxy CMOS Chips HAN Zhaofang,XIE Da,QIAO Yanmin 8(37)

Endurance Analysis of Ge2Sb2Te5-based Phase Change Memory LI Ying,ZHAN Yipeng,WANG Lei 8(41)

The Performance Test and Reliability Evaluation of 150 nm GaAs PHEMT Based on the 248 nm Stepper GUO Xiao,ZHANG Junyun,LIN Gang 8(44)

Study of Halo Technology in Improving Device Performance XU Zheng,LI Hongzheng,ZHAO Wenbin 9(35)

Study of Radiation Hardening Technology of Bulk CMOS Integrated Circuits MI Dan,ZUO Lingling 9(40)

Feasibility Study on Wafer Dicing by Silicon Deep Reactive Ion Etching LIU Xueqin,DONG Anping 9(44)

Optimization of Contact Layer Illumination Type to Improve Lithography Manufacture LIU Juan 10(36)

Studies of Transient Temperature Response of Power Amplifier ICs in T/R Module SHENG Zhong,ZHOU Jun,DING Xiaoming,SHEN Ya 10(39)

Research of Full-power Aging Technology for Microwave Transistor WANG Xiaoping,LI Xue,ZHANG Limin,QIN Hao 10(43)

An Optimization Method of 1200 V IGBT LI Hong 11(44)

Studies of Quality Control During Secondary Screening WANG Yu 12(40)

Products&Application&Market

Repair and Application of IC Handler ZHOU Chun,JIANG Wenguang 1(38)

Software Design of Embedded Image-processing System Based on TMS320DM8168 WANG Xiaolong,SHAO Chunwei,ZHU Chen 1(44)

A Kind of Highly Reliable Serial Communication Protocol GUI Jianghua,SHAO Jian,PAN Miao 2(40)

Research on Automatic Test System of High Voltage ACParameters Based on Microcomputer CHEN Yang,XIE Lili 2(44)

A New Type Thermal Method for Oxygen Concentration Measurement QIAN Jiangrong,CHEN Cong,XU Lei,HU Guojun 3(45)

Advanced Transport Package Material Solution for WLCSP Component YANG Qing 6(43)

Design and Application of System of Surface Water Quality Monitoring and Warning based on Internet of Things ZHANG Jing,HUANGFU Weizhe 12(44)

猜你喜欢
芯片工艺设计
转炉高效复合吹炼工艺的开发与应用
山东冶金(2019年6期)2020-01-06 07:45:54
5-氯-1-茚酮合成工艺改进
世界农药(2019年2期)2019-07-13 05:55:12
瞒天过海——仿生设计萌到家
艺术启蒙(2018年7期)2018-08-23 09:14:18
设计秀
海峡姐妹(2017年7期)2017-07-31 19:08:17
有种设计叫而专
Coco薇(2017年5期)2017-06-05 08:53:16
芯片测试
多通道采样芯片ADS8556在光伏并网中的应用
一段锌氧压浸出与焙烧浸出工艺的比较
铜业工程(2015年4期)2015-12-29 02:48:39
络合铁脱硫工艺在CK1井的应用
74HC164芯片的应用
河南科技(2014年10期)2014-02-27 14:09:18