Journal of Harbin Institute of Technology(New Series)
- Thermal Stress and Assembling Parameters Evolution of CMC Bolted Joint under Transient Thermal Loads
- Elastic Model of Flexure-Based Linkage under Motion Constrains and External Load
- General Expression of LRC Method in Estimation of Bridge’s Equivalent Static Wind Load
- Time-Domain Traveling Wave Model of Single-Section Quantum Dot Mode-Locked Lasers with Optical Feedback
- Influence of Assembly Parameters on Tensile Behavior of Hybrid CMC and Superalloy Bolted Joints by Progressive Damage Analysis
- Representation of Dynamic Positioning on Hovering Type Autonomous Underwater Vehicle in Precise Welding Operations
- Dynamic Modeling and Analysis of 4UPS-UPU Spatial Parallel Mechanism with Spherical Clearance Joint
- Improving Deep Attractor Network by BGRU and GMM for Speech Separation
- Effect of Tea Polyphenols on Lipid Oxidation of Nemipterus Virgatus Surimi Cake During Ice Storage